“Power integration modules (PIM) are widely used in various fields such as drives, pumps, heating, ventilation and air conditioning (HVAC), energy conversion, etc., to realize the modulation and efficient use of energy.
Power integration modules (PIM) are widely used in various fields such as drives, pumps, heating, ventilation and air conditioning (HVAC), energy conversion, etc., to realize the modulation and efficient use of energy. ON semiconductor’s innovative die-casting mold PIM (TMPIM), which integrates the best IGBT/FRD technology, uses reliable substrate and epoxy resin die-casting technology, and increases thermal cycle life by 10 times compared with ordinary gel-filled power modules. Increasing the power loop service life by 3 times is beneficial to the inverter system to achieve higher energy efficiency, longer service life and higher reliability. It is suitable for industrial motor drives, pumps, fans, heat pumps, HVAC, servo control and other applications .
Introduction to TMPIM
Ordinary PIM is fixed on the substrate with a plastic frame and glue, and the inside is filled with insulating gel. TMPIM uses semiconductor-grade epoxy resin plastic packaging to cover power semiconductor devices and substrates at one time. The advantages of this process are: compact size, simple process, long module service life, strong, corrosion resistance, substrate selection and customized design Flexibility. Therefore, TMPIM has higher energy efficiency, reliability and power density. According to the power level, TMPIM is divided into three series: Compact, DIP-26 and QLP-74. ON Semiconductor has launched 1200 V25 A, 35 A and 50 A TMPIMs, belonging to the DIP-26 series, covering 3.75 kW to 10 kW, providing converter-inverter-brake (CIB) and converter-inverter The CI architecture version is an ideal choice for HVAC and industrial drive applications. In the future, 1200 V and 650 V products from 35 A to 200 A will be launched, including the QLP-74 series covering 10 kW to 20 kW. Full spectrum coverage to meet various power requirements. The following table lists the TMPIM modules that ON Semiconductor has launched.
Application diagram of TMPIM CIB power module
All DIP-26 series CIB/CI modules share one pin, and the brake pin of the CI module is connected to the pin. Modules of various voltages and powers share one pin and PCB wiring, which will greatly reduce the design workload of developers and facilitate future power upgrades.
TMPIM CIB module is widely used in HVAC, motor drive and servo control fields. When working, the converter takes power from the grid and rectifies the alternating current to direct current. According to the different grid voltages in various countries, the module voltage is divided into 650 V and 1200 V. Among them, the 650 V TMPIM CIB module is suitable for 240 V 3-phase inverter, and the 1200 V module is suitable for 400 V 3-phase inverter. The bus capacitor is usually connected after the converter to reduce the ripple of the dynamic power of the inverter.
The inverter part is usually composed of 3 phases, 6 IGBTs and diodes, while controlling the switch, it converts direct current to alternating current. Because the IGBT switch is controllable, the frequency and phase of the output AC are adjustable, and the speed and torque of the motor and compressor can be precisely controlled. When we define the ampere of the module, it refers to the rated current of the inverter part. As a reference, CIB modules of 1200 V, 25 A/35 A/50 A can usually output 5 kW, 7.5 kW, and 10 kW respectively. When the control and cooling conditions change, the output power will change greatly, which can be obtained by the online simulator of ON Semiconductor.
When the motor is braking/decelerating, the motor coil becomes the power generation mode. When the inertia is large, the energy will recoil the bus capacitor, which may cause the capacitor to overvoltage and break down. The brake IGBT will be turned on at this time to connect to the externally connected brake. The resistance discharges the capacitor. When applied to small inertia scenarios such as compressors, fans, and pumps, the recoil energy is very small, and the brake can be removed. The module that removes the brake is referred to as the CI module.
TMPIM standard and enhanced internal structure
ON Semiconductor provides standard and enhanced versions of TMPIM. Although the standard type and the enhanced type have the same appearance and size, the enhanced type uses a more advanced substrate, has higher reliability and copper thickness, and achieves lower thermal resistance and higher output power. The standard type uses a copper clad (DBC) substrate, which has a higher cost performance.
TMPIM compares mainstream competitive devices on the market
ON Semiconductor compares the 35 A standard CIB TMPIM module and the 50 A enhanced CIB TMPIM module with gel-filled modules without copper substrates and gel-filled modules with copper substrates on the market under the same conditions. The results show that , The DC curve, AC curve, and switching waveform of the CIB TMPIM module are better than competing devices on the whole. TMPIM has lower power loss and higher energy efficiency.
In the power loop test, the heat sink temperature and case temperature of TMPIM are better than competing devices.
In the motor test, the 1200 V, 35 A standard CIB TMPIM module drives a 380 V, 7 kW compressor. When the speed reaches the maximum speed of 6500 rpm, the measured temperature of the IGBT is 1100C, to meet the customer’s maximum operating temperature requirements and have a margin; the 50 A enhanced CIB TMPIM module continues to work up to 20 kW output under high load conditions, and the temperature of the module at the highest speed is lower than the temperature of competing devices.
In the short-circuit test, TMPIM IGBT has good short-circuit current characteristics while achieving high energy efficiency.
In the temperature cycle life test, at -40 0C to 125 0Under the test condition of C, the temperature of the TMPIM module was cycled for 1000 cycles, and there was no obvious change and delamination phenomenon, while the competitive device was damaged after 100 cycles.
In addition to changes in ambient temperature, power devices themselves also generate heat during operation. In a comparison test with competing devices, TMPIM benefited from the protection of the resin on the bonding wire and solder layer, and its cycle life was 3 times that of ordinary gel-filled power modules.
In the internal and external quality standard tests such as high temperature, high pressure, high humidity, power and temperature cycle, TMPIM all passed the test.
In the thermal resistance test, the thermal resistance of the enhanced TMPIM is lower than that of the competitive device with a copper substrate, and the thermal resistance of the standard TMPIM is similar to that of a gel-filled module without a copper substrate.
In terms of power density, when the output is the same or high, TMPIM is lighter and has a higher power density than competing devices, and is suitable for applications that are sensitive to volume and weight.
To evaluate the TMPIM power module, please click https://www.onsemi.cn/pub/Collateral/EVBUM2669-D.PDF to download the TMPIM evaluation board reference design.
Motor Development Kit (MDK) out of the box
Motor drive systems are increasing rapidly along with industrial automation and robotics, and their power consumption exceeds 50% in industrialized countries. About 80% of them are AC induction motors, and the average energy efficiency is only 44%. The power module is the key to improving the performance, energy efficiency and reliability of the motor drive system and realizing accurate measurement and control. To help designers accelerate the development of more energy-efficient motor control solutions, ON Semiconductor has introduced an advanced and flexible MDK, suitable for applications ranging from less than 1 kW to more than 10 kW. This modular comprehensive prototype platform includes a universal controller board (UCB) and one of a series of continuously expanding motor drive evaluation boards. The software development support comes from Xilinx for high-level synthesis in the form of a Vivado® design kit. UCB uses Xilinx’s Zynq®-7000 Field Programmable Gate Array (FPGA) / ARM System-on-a-Chip (SoC), which is suitable for high-end control and artificial intelligence (AI)-based applications. USB can also be programmed in Python through Xilinx’s open source project PYNQ. UCB is fully compatible with Xilinx development tools and libraries, and is developed in cooperation with Trenz Electronic.
MDK brings together ON Semiconductor’s expertise and technology in the power supply field, from low- and medium-power intelligent power modules (IPM) to high-power PIMs, as well as auxiliary power controllers, gate drivers, power MOSFETs, operational amplifiers, detection, etc. And advanced packaging technologies, integrate these technologies into a single ecosystem, and use them out of the box.
Among them, IPM-based solutions are mainly used for industrial and household electrical appliances motor drive applications up to 10 kW, providing a good performance compromise in terms of low EMI, safety, stability and reliability, and switching speed. IPM highly integrates substrates, power switches, power diodes, gate drivers, passive components, etc., which can replace 45 to 100 discrete components, has good fault tolerance, simplified thermal management, easy PCB board design, and built-in isolation greater than Equivalent to 2 kW, protection functions include over-voltage/under-voltage lockout, anti-breakdown and over-current tripping. The SECO-1KW-MCTRL-GEVB and SECO-MDK-4KW-65SMP31-GEVB currently supported by ON Semiconductor’s MDK use IPM technology and are suitable for driving motors up to 1 kW and 4 kW respectively.
SECO-1KW-MCTRL-GEVB provides a complete solution from the AC input of the mains to the AC output of the motor. The rated input voltage is 230 Vac, which includes an EMC filter and bridge rectifier, interleaved two-channel power factor correction (PFC) and NFAQ1060L36T IPM as the inverter stage, as well as auxiliary power supply, measurement and protection.
SECO-4KW-65SPM31-GEVB driver board uses NFAM5065L4B 650 V intelligent power module, rated input voltage is 400 VDC, can provide up to 1 kW continuous power, and can provide up to 4 kW power in a short time or by adding a heat sink , Very suitable for industrial drive and commercial heating, ventilation, air conditioning and refrigeration (HVACR) applications.
The TMPIM-based solution is used in industrial motor applications up to 50 kW, providing an excellent compromise between design flexibility, reliability, thermal performance and a wide power range, and has multiple advantages as described above. Power boards based on ON Semiconductor’s TMPIM technology will be launched in the first quarter of 2021.
At the same time, ON Semiconductor also provides loss simulation tools Powertrain and thermal models constructed from empirical data to help designers quickly understand and compare the thermal performance and loss of each option and optimize them according to requirements, thereby further accelerating development. The online simulation website of TMPIM is https://www.onsemi.cn/site/design-tools/motion-control/, you need to register a free account, find the TMPIM package such as DIP-26 and product number, then you can start the simulation .
ON Semiconductor’s TMPIM adopts innovative technology, advanced thick copper substrate and epoxy resin die-casting technology, which reduces the volume by 57% compared with ordinary gel-filled power modules, and increases the thermal resistance by 30%, which greatly increases the power density. The thermal cycle service life is increased by 10 times, and the power loop service life is increased by 3 times, providing higher energy efficiency and boosting the longer service life and high reliability of the terminal inverter system. The module is sealed with epoxy resin molding and nickel-plated on the back to prevent the formation of dendrites between the copper pads. It is suitable for working in certain corrosive gas working environments. The pin and the heat sink have an electrical gap of 6mm, in line with IEC61800-5-1 Standard and UL1557 standard (E608861). ON Semiconductor’s MDK provides an ecosystem that combines hardware, software, and TMPIM power modules to provide an “out-of-the-box” experience for evaluating variable-speed motor inverter solutions, enabling the originally complex and time-consuming motor drive development work It becomes simple and greatly optimizes energy efficiency, operating costs and design flexibility.